GE mCOM10-L1500 Data Sheet

GE Rugged COM Express Module Data Sheet - mCOM10-L1500.
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GE

Intelligent Platforms

FEATURE

BENEFIT

Small form factor

• Size(84x55mm)makesthemCOM10-L1500idealforapplicationswherecompactsizeiscritical

Rugged design with soldered components

• Reliablecomputingcapabilitiesforapplicationsneedinghigherimmunitytoshockandvibration

Next-generation multicore  
AMD G-Series SOC

• Delivershighperformancecoupledwithlowpowerconsumption
• Supportsmultiplegraphicsdisplays

Flexible options

• Shockandvibrationprotection
• Extendedoperatingtemperaturerangeforenvironmentswithtemperatureextremes
• Conformalcoatingforprotectionagainstdust,moistureandchemicals

Asbillionsofmachinescontinueto
expandtheIndustrialInternet,theywill
beperformingmoretasksatgreaterspeed
andoperatinginharshenvironments.At
thesametime,computerprocessorswill
continuetoevolve.

Toremaincompetitive,GEIntelligent
Platformsunderstandsthatbusinesses
mustproactivelyrespondtothesetwin
forcesofmachineconnectivityand
processorobsolescence.

Toaddresstheseneeds,GEdeveloped
themCOM10-L1500.Thismoduletakes
advantageoftheflexibilityincost,perfor-
manceandpowercapabilitiesofthe
latestgenerationAMDEmbeddedG-Series
System-on-Chip(SOC).Andthankstoits
COMExpressarchitecture,aschiptech-
nologyevolves,themodulecanbereplaced
withoutadverseeffectontheunderlying
hardwareandassets.

ThemCOM10-L1500isidealforavariety
ofcommercial,industrial,transportation
anddefenseapplicationsinarangeof
embeddedcomputingenvironments.This
durableCOMExpresssolutionreduces
overalldesigncycleandvalidationrequire-
mentstolowerthetotalcostofownership.

Best-in-class performance & reliability
GE’smCOM10-L1500COMExpressmodule
istheminiatureform-factorsolutioninour
COMExpressportfolio,andoffersthehigh-
levelperformanceandultimatedurability
neededforapplicationsthatoperatein
harshenvironments.Itisidealforapplica-
tionsrequiringasmallformfactorand
lowpowerconsumptiononatype10COM
Expressplatform.AswithallGECOM
Expressmodules,themCOM10-L1500
fullyusesthecapabilitiesofthenewest
generationofprocessors.

On-boardcomponentsarespecifically
selectedfortheirreliabilityindemanding
conditions.Unlikesolutionsdesignedfor
benignenvironments,theprocessorand
memoryaresolderedtotheboardfor
maximumresistancetoshockandvibra-
tion.Extendedmechanicalconstruction
protectsthemodule,whichisdesigned
foroptionalconformalcoatingtoprovide
additionalresistancetomoisture,dust,
chemicals,andtemperatureextremes.

Longer lifecycles & lower product costs
TheCOMExpressarchitectureextends
theusefullifeofthesubsystembyallowing
asimple,cost-effectiveupgradeofthe
processoralone.Thelong-termcostof
ownershipisreducedwhileensuring
thatperformancekeepspacewith
changingneeds.

Commitment to customer satisfaction 
Today’sorganizationsareoperatinglean,
engineeringresourcesarescarce,and
time-to-marketiscritical.Therefore,GE
complementstheperformanceandprac-
ticalbenefitsofourCOMExpressmodules
withworld-classdomainexpertiseanda
focusonexceptionalcustomerservice.
Tohelpyougettomarketfasterandlower
yourdevelopmentcosts,wecanassist
youwithin-housecarrierdesign,orbuild
acarrierspecificallyforyou.

mCOM10-L1500

MiniCOMExpressModule

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